Mechanical & Thermal Solutions Architect (NCG 2026)

.Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

As a Mechanical – Thermal Solutions Architect, you will be responsible for ideating and developing systems around Astera Labs products. This includes 3D modeling of components and system level assemblies, running thermal simulations and analyses, and driving a holistic vision around data center system architectures. You’ll align innovation efforts with company goals and drive the creation of compelling product demos, highlight differentiated hardware solutions, and influence customer system architectures ensuring Astera Labs solutions are accelerating AI and cloud infrastructure.  

Responsibilities 

• Design and develop data center components and systems in 3D CAD modeling software 

• Design and analyze thermal solutions like heatsinks, vapor chambers, liquid cooling cold plates, etc using thermal simulation software 

• Collaborate with cross functional teams in product management / marketing, hardware engineering, and silicon engineering  

• Influence product and technology roadmaps with system driven inputs 

• Build component and system prototypes, proofs of concept (POCs), and demonstrations for customers and industry events 

Basic Qualifications 

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or related technical field 

• 1-year of experience in engineering in the semiconductor, data center, cloud, or networking industry 

• Basic understanding of PCIe, CXL, Ethernet, and UALink interconnect standards 

• Basic understanding of data center architecture in regards to thermal and mechanical components and systems 

• Experience collaborating with hyperscalers, OEMs/ODMs, or silicon ecosystem partners 

• Proficient in 3D solid modeling (Solidworks, PTC Creo, etc) 

• Capable of running mechanical and thermal simulations (Fluent, Icepak, Flotherm) 

• Ability to translate complex technical findings into clear, compelling business and marketing narratives 

• Excellent communication and presentation skills for engaging customers, partners, and industry events 

• Experience working cross-functionally across engineering, product management, and marketing teams 

• Proven project management skills to plan, prioritize, and execute across multiple stakeholders 

Preferred Qualifications 

• Master’s degree in Engineering, Computer Science, or Business/Marketing with a technical focus 

• 1-year of experience in product or technical marketing in the semiconductor, data center, cloud, or networking industry 

• Familiarity with air cooling and liquid cooling systems used in data center architectures 

• Experience creating reference architectures and coordinating between signal integrity, mechanical, and thermal domains 

• Track record of thought leadership via white papers, technical blogs, or conference presentations 

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.