Electronic Engineering Technical Lead

Who we are

About BBPOS

BBPOS is one of the world leaders in payment devices and the inventors of mPOS technology. BBPOS products are used by large retailers and leading online platforms across multiple industries.  BBPOS is engaged in the business of manufacturing and supplying mobile and smart point-of-sale hardware, and the underlying software and infrastructure to deploy, manage, and monitor those devices.  BBPOS is now part of Stripe’s Terminal business since the acquisition in March 2022.  

About the team

Post acquisition, the BBPOS team is now an extension of the Stripe Terminal team.  Stripe Terminal helps Stripe users extend their online presence into the physical world. The Terminal team’s mission is to make it as easy for businesses to accept in-person payments as the Stripe API has done for online payments. With Terminal, businesses can unlock in-person payments use cases that are right for their business model—whether it’s creating a flagship retail experience, extending their website to a pop-up store, or enabling a mobile point-of-sale at their next event. 

Stripe is a financial infrastructure platform for businesses. Millions of companies—from the world’s largest enterprises to the most ambitious startups—use Stripe to accept payments, grow their revenue, and accelerate new business opportunities.

We are expanding our EE team in our Taiwan office and are seeking an experienced and innovative Electronic Engineering Technical Lead to join our team. 

Examples of products designed by BBPOS for Stripe:

https://stripe.com/terminal/s700

https://stripe.com/terminal/m2

What you will do: 

• Work with cross-functional teams e.g. EE, ME, Product, Compliance, Firmware, QA, Manufacturing Production and Manufacturing Testing teams to ensure designs meet overall system requirements. The extended team is located in multiple locations such as Hong Kong and USA.
• Lead technically a team of electrical engineers in the design, development,  testing and contribute to the architecture and design of hardware for electronic payment terminals including Android based systems. While you are expected to help in all areas of the design, including baseband, RF related communication interface, security and payment related functions. 
• Oversee project timelines, budgets, and resource allocation to ensure timely and cost-effective project completion.
• Develop and implement electrical engineering procedures, design validation review, to ensure compliance with industry standards, international regulations,  payment certification and safety requirements.
• Provide technical guidance and mentorship to engineering team members.
• Review and approve technical documentation, drawings and specifications.
• Conduct performance evaluations and support the professional growth of team members.
• Identify and resolve technical issues and challenges in a timely manner.
• Stay updated with the latest advancements in electrical engineering, payment technologies.
• Travel to OEM, supplier and different site offices for project follow up as needed.
• Perform other engineering tasks as assigned to meet internal or external company support requirements..

Who you are

We’re looking for someone who meets the minimum requirements to be considered for the role. If you meet these requirements, you are encouraged to apply. The preferred qualifications are a bonus, not a requirement.

Minimum requirements

• Bachelor’s degree or above in Electrical/Electronics Engineering or a related discipline.
• 10+ years of system level design with a strong background in payment terminal or mobile industry.
• Knowledge of AP and secure processor system design
• Experience with project management, able to work independently but also a good team player 
• Proven experience in technical leadership.
• Possess good interpersonal and have good problem solving skills 
• Good command of spoken & written English and Mandarin.
• Ability to visit test labs during debug and certification process.  
• Station in the Taiwan site office and occasional travel both locally and internationally would be needed (~10%).

The domain knowledge requirements

• EE System knowledge requirements
• In-depth knowledge of Electronics system design and understanding of the interactions between the different sub functions, and design principles.  
• Knowledge of embedded High speed systems design including integration Application processor, Security processor, high speed memory bus, MIPI LCD with capacitive touch panel, MIPI Camera, USB-C interface and how they impact RF performance. 
• Knowledge of power circuit management including DC-DC converters, Lithium battery, PD charger and its noise interactions between PCB boards, FPC and modules.
• EMC product debug, troubleshooting and approval hands-on skill.
• Conduct circuit and design review on each project before development phase exit.
• Ability to advise on PCB layout to reduce EMI and RF desensitization.
• Familiar with WiFi and bluetooth communication interface and system integration.
• NFC contactless knowledge requirements
• Good understanding of NFC systems including NFC theory of operation especially active load modulation, NFC circuit design, NFC antenna design considerations

Preferred qualifications

• Familiarity with high-speed system simulation software and debug tools.
• Good understanding of RF fundamentals including Noise Figure, Sensitivity, Error Vector Magnitude, Harmonics, Smith Charts & Tuning Networks, Transmission lines, etc.
• Hands-on experience on EMVCo contactless level 1 debug and equipment testing is a plus. 
• Hands-on experience in PCI security design on POS terminal development.

For more information of the BBPOS and our career opportunities, please visit our website www.bbpos.com

We offer long-term career prospect and competitive remuneration package to the appointed candidate.

Personal data collected will be used for recruitment purposes only. Applicants not contacted within 8 weeks of applying should consider their applications unsuccessful.