Packaging Integration Engineer

Cspeed IO is a stealth start up backed by Sutter Hills Ventures and Atreides Capital - headquartered in Palo Alto, CA.  Our executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware.

Cspeed IO is developing next-generation optical semiconductor solutions for the AI infrastructure market, focused on enabling true “scale-up” architectures.  Our mission is to replace traditional copper interconnects with advanced fiber-optic technologies that overcome the limitations of existing optics solutions and architectures.

Duties, Deliverables, and Responsibilities
●    Drive Cspeed’s package from initial concept to production
●    Help establish photonic and electronic co-design process flow
●    Work with OSAT’s to define integration packaging design rules, process flow, and materials
●    Lead optical package development to establish package manufacturability and reliability.
●    Collaborate with cross-functional teams including of silicon photonics, IC design, layout, test and reliability to drive the package/integration forward 
●    Work with external foundries and OSAT’s on process integration and packaging for interposer

Expertise, Knowledge, and Skills
●    Understanding of 2.5D and 3D packaging technologies, i.e. interposers, heterogeneous integration, high-density interconnects
●    Ability to select and manage external foundries/OSATs for interposer-based packaging (must understand material selection, state of the art techniques, and advanced process flows required for advanced packaging)
●    Must have strong program/project management skills (i.e. set schedule, maintain it, ensure parts arrive on time in the right place, etc.)
●    Clear communication, ability to work cross-functionally and interface with design, SI/PI, testing, vendors, OSATs, etc
●    Bonus: Familiarity with layout design for high-speed applications, simulation, mechanical and thermal analysis 

Experience, Background, and Accomplishments
●    Driven multiple 2.5/3D high-speed packages end to end, working with all roles on the packaging team (design, layout, SI/PI, test and reliability, etc.)  
●    Experience driving packages with unconventional needs / uncommon processes
●    Experience working with large, established OSAT’s and foundries on custom processes and flows
●    B.Sc.+ in EE or Materials or optics
●    Bonus: experience with CPO packaging, integrated PIC + EIC package