Job Application for BSP Embedded S/W at Ethernovia, Inc.

About Ethernovia, Inc.

Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company’s breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications.

Ethernovia's co-founders are serial technology entrepreneurs with multiple prior successful ventures together. We are well-funded and backed by some of the worlds’ leading technology investors, having secured $154M ($90+M Series-B and $64M Series-A) in total funding to date:

Ethernovia Raises Over $90 Million Series B to Scale Leading-Edge Autonomy and Physical AI Networking Chips
Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks | Business Wire
- (financial backers include: Porsche SE, Qualcomm, AMD, Western Digital, Maverick Silicon, Socratic Partners, Conduit Capital, and CDIB-TEN Capital)

Ethernovia has been recognized in EE Times' prestigious list of the Top 100 Startups for 2025.

With talented employees on 4 continents, we have filed 50+ patents to date.

Join Ethernovia’s team to make a lasting impact on the future of packet processor-centric networking solutions to support the real-time sensor, Physical AI, and control data demands of software-defined autonomy across vehicles, robots and intelligent machines. Come share in our success with pre-IPO shares, competitive compensation, and great benefits while growing your knowledge and career with world class talent. We are looking for talented engineers and leaders who have an entrepreneurial spirit and want to drive cutting edge designs from concept to silicon to the future of mobility.

Job Description

Collaborate with cross-functional teams, including hardware, software, and product management to develop & lead platform bring up activities.
Triage and debug platform side of issues focusing on SOC interaction.
Understand platform components, define standards for hardware definition and influence part selection.
Define and develop new insights for next generation of SOC based products from platform side.
Lead platform SW development for different generations of SOC based products.
Lead all aspects of SoC packaging processes, ensuring compatibility and performance across different platform components.
Stay at the forefront of the latest advancements in SoC and platform technologies and drive their adoption within the team.

Technical Qualifications

Bachelor’s or master’s degree in computer science, Electrical Engineering, or a related field.
5+ years of proven experience in developing features, resolving issues at SOC and platform level.
Deep understanding of the windows kernel driver.
Have handled issues and developed platform level features.
Extensive experience with debugging tools and techniques.
Proficiency in programming languages such as C, C++, and assembly.
Strong problem-solving skills and attention to detail.
Excellent communication, leadership, and teamwork abilities.

Soft Skills

Self-motivated and able to work effectively both independently and in a team.
Excellent communication/documentation skills.
Attention to details.

What you’ll get in return:

Technology depth and breadth expansion that can’t be found in a large company.
Opportunity to grow your career as the company grows.
Pre IPO stock options
Cutting edge technology
World class team
Competitive base salary
Flexible hours

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BSP Embedded S/W

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