Intern, Signal Integrity & Power Integrity
Office Location: San Jose, CA
Work Model: Onsite
Duration: June 2026 – August 2026
-
We are offering an exciting opportunity at SK Hynix America for an IC Packaging electromagnetic (EM) simulations and SIPI (Signal Integrity/Power Integrity) Analysis Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in 3D modeling and high-speed digital system analysis of advanced packages. You will be introduced to the basics of the advanced package design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success.
Responsibilities:
- Become familiar with various IC packaging structures and the process steps involved in making the end product.
- Learn the basics of using numerical analysis tools such as ANSYS AEDT(HFSS, Q3D) etc.
- Learn the basics of using numerical analysis tools such as ADS, HSPICE etc.
- Start developing package-level electrical Finite Element Analysis (FEA) Models to characterize S-parameters and RLC in the packages
- Conduct signal and power integrity simulations across the entire product lifecycle, from feasibility and pre-layout to post-layout and validation.
- Learn to design and layout guidelines for IC packages and PCBs to ensure signal and power integrity
- Document all simulation models, codes, and scripts and present the results in simple and clear terms to a broader audience
Qualifications:
- Currently pursuing a Master's or PhD's degree in Electrical Engineering or a related field.
- Strong interest in transmission line theory, electromagnetic concepts and its applications in semiconductor packaging
- Strong interest in signal integrity, power integrity fundamentals and its applications in semiconductor packaging.
- Strong problem-solving and analytical skills.
- Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.
Preferred Skills
- Currently pursuing a PhD's degree in Electrical Engineering or a related field
- Familiarity with SIPI simulation tools such as Ansys AEDT (HFSS, Q3D), Synopsys Sigrity, ADS, and HSPICE.
- Basic understanding of semiconductor packaging concepts and materials is advantageous.
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees, and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
Create a Job Alert
Interested in building your career at SK hynix America? Get future opportunities sent straight to your email.
Apply for this job
*
indicates a required field