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Intern, Thermal Analysis on Advanced Package Architecture

San Jose, CA
Job Title: Intern, Thermal Analysis on Advanced Package Architecture
Office Location: San Jose, CA
Work Model: Onsite
Duration: June 2026 – August 2026
 
At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
 
Position Summary:

  • We are offering an exciting opportunity at SK Hynix USA for IC Packaging Thermal Analysis Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in Thermal modeling and characterization of advanced packages. You will be introduced to the basics of the advanced package design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success.


Responsibilities:
  • Become familiar with various IC packaging structures and the process steps involved in making the end product.
  • Learn the basics of using numerical analysis tools such as ICEPACK etc.
  • Start developing thermal FEA models to characterize the package/system level thermal resistance and other thermal performance parameters.
  • Learn to interpret the Thermal behavior of models and simulation results and correlate to observed behavior and measurements.
  • Document all simulation models, codes, and scripts and present the results in simple and clear terms to a broader audience

Qualifications: 

  • Currently pursuing a Master's or PhD's degree in Mechanical Engineering, Materials Science, or a related field.
  • Strong interest in heat transfer, finite element analysis and its applications in semiconductor packaging.
  • Strong problem-solving and analytical skills.
  • Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment

Preferred Skills 

  • Currently pursuing a PhD's degree in Mechanical Engineering, Materials Science, or a related field.
  • Familiarity with FEA software (e.g., ICEPACK/FloTherm) is a plus.
  • Basic understanding of semiconductor packaging concepts and materials is advantageous

Housing Allowance: 
Eligible interns will receive a housing allowance during their internship.  
 
 
Equal Employment Opportunity:
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees, and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.  
 
 
Compensation:

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