Astera Labs is a global leader in purpose-built connectivity solutions that unlock the full potential of AI and cloud infrastructure. Our Intelligent Connectivity Platform integrates PCIe®, CXL®, and Ethernet semiconductor-based solutions and the COSMOS software suite of system management and optimization tools to deliver a software-defined architecture that is both scalable and customizable. Inspired by trusted relationships with hyperscalers and the data center ecosystem, we are an innovation leader delivering products that are flexible and interoperable. Discover how we are transforming modern data-driven applications at www.asteralabs.com. 

Job Description:

As an Astera Labs New Product Introduction (NPI) / Electrical Product (EPE) Engineer, you will be part of a Hardware Engineering team that designs and manufactures products featuring Astera Labs’ portfolio of connectivity ASICs used in the world’s leading cloud service providers, server, and network OEMs. In this role, you will be responsible for NPI—taking products from the design stage to volume manufacturing. You will work closely with designers, manufacturing teams, suppliers, and contract manufacturers to ensure that hardware product test flows are properly introduced, released to manufacturing, and supported past production.

This role will also require engagement in activities such as Bill of Materials (BOM) management, Design for Manufacturability (DFM), validation, and process documentation. Additionally, the EPE is expected to drive continuous improvements in manufacturing test flow, product yield, and cost efficiency.

While your focus will be on NPI/EPE, you will have the opportunity (and be expected—depending on your experience) to contribute to adjacent areas such as test engineering, validation, and quality. Being part of a growing manufacturing team, we welcome the diverse experience you bring.

Key Responsibilities

• Own manufacturing NPI/EPE activities, ensuring successful product transition from design to volume manufacturing.

• Manage PCBA BOM structuring and risk assessment to improve manufacturability and minimize changes late in the cycle.

• Lead BOM release through ECO and PLM tools, ensuring alignment with cross-functional teams.

• Analyze end-to-end manufacturing capacity and work with operations teams for future planning.

• Collaborate with cross-functional partners on developing Contract Manufacturer (CM) capabilities to prototype, launch, and transition products to high-volume production.

• Identify and mitigate contract manufacturer gaps in capabilities, process readiness, and documentation.

• Work with factory and engineering teams to troubleshoot failures, perform root cause analysis, and implement corrective actions.

• Participate in and help define key manufacturing processes, including NPI, product engineering, validation, and quality control.

• Drive improvements in SMT process flow, quality control, and inline inspections.

• Develop clear, precise manufacturing instructions, rework, and deviation documentation.

• Work cross-functionally to understand and resolve issues throughout product lifecycle with emphasis in hardware design and manufacturing.

Basic Qualifications

• 5+ years of experience in NPI/EPE roles.

• Strong academic and technical background in electrical engineering or electronic manufacturing. Bachelor’s in EE or equivalent experience required.

• Minimum of 5 years’ experience in test engineering or electronics manufacturing.

• Entrepreneurial, open-minded behavior with a strong "customer-first" mindset.

• Ability to travel to CMs as needed to support production ramp-up and troubleshooting.

Required Experience

• Strong understanding of high-tech manufacturing processes, NPI activities, and product development lifecycle.

• Experience working with off-shore contract manufacturers.

• Track record of successfully launching complex electronic products.

• Demonstrated ability to analyze and optimize manufacturing test data to improve yields and efficiency.

• Experience with DFM, Design for Testability (DFT), and Design for Assembly (DFA) methodologies.

• Bill of Material (BOM) structuring and risk management experience with PLM tools (e.g., Arena, Agile).

• Strong debugging experience for hardware design and production failures.

• Root cause analysis of contract manufacturing issues.

• Experience implementing process documentation and manufacturing best practices.

Preferred Experience

• Familiarity with optical/electrical networking module manufacturing and testing (e.g., SFP+, QSFP, OSFP), data center class products such as servers, network switches, modular chassis, and/or PCIe add-in cards

• SMT process improvement and quality control methodologies.

• Data analysis and reporting using Python.

• Ability to assess and close Contract Manufacturing gaps in capability.

• Proficiency with EE design tools, including schematic capture and PCB layout (Cadence, Altium, etc.).

• Technical writing experience for generating clear and precise manufacturing documentation.

• Exposure to ASIC/silicon development and hardware validation processes.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.