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Senior Packaging Engineer

Torance, CA (Hybrid)

About Us

Red Cell Partners is an incubation firm building and investing in rapidly scalable technology-led companies that are bringing revolutionary advancements to market in three distinct practice areas: healthcare, cyber, and national security. United by a shared sense of duty and deep belief in the power of innovation, Red Cell is developing powerful tools and solutions to address our Nation’s most pressing problems. 

About Claros 

Claros innovates at the intersection of power and compute. We build advanced semiconductor power management solutions that improve AI compute capacity, efficiency and reliability.  

Claros is an early-stage startup company located in Torrance, CA. If you are looking for challenging work and a strong technical environment with the collaborative & supportive culture, then Claros Tech is the company for you. We offer industry the best competitive pay & benefits and early-stage stock options. 

Location: Minimum of 3 days a week in the office in Torrance, CA.  

About the Team: 

We are open-minded, fast paced, problem solvers that value open dialogue and candor. Our passion is to challenge the status-quo and we embrace transformational thinking.  Our response is never “no, but….” instead “yes, if….”.  We are mindful of our personal and organizational blinders and try to build an environment where are team members are At Their Best. 

This role will report to: Vice President of Engineering  

Role Description: 

Claros Inc. is seeking to hire an exceptional Senior Packaging Engineer to join our team in Torrance, CA. Candidate must be self-motivated individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements.  

 

Responsibilities: 

In this role, you will be responsible for the design and development of electromechanical packaging high-performance analog circuits for PMICs used in a range of applications. 

  • Provide deep expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.  
  • Lead in identification, development & qualification; program management with external assembly partners 
  • Lead in power supplier(s) engagement to define technology and quality requirements. 
  • Interface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team. 
  • Support new design wins, NPI and volume ramps. 
  • Develop alternate sourcing & qualification. 

Required Qualifications: 

  • 4~6 years Hands On experience in 2.5D / 3D Development;  In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions. 
  • Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc) for design optimization. 

Preferred Qualifications: 

  • Master's degree in mechanical / electrical / Electronic Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable) 
  • single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; 
  • Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution;  
  • Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems. 
  • Good team player with project management, analytical, problem-solving and interpersonal skills. Must be self-driven, flexible and agile, result oriented individual. Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems and handle multiple programs concurrently. 
  • Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.  

Benefits: 

  • Career track opportunity with potential for rapid advancement with strong performance as the firm grows.  
  • 100% employer paid, comprehensive health care including medical, dental, and vision for you and your family.  
  • Paid maternity and paternity for 14 weeks at employees' normal pay.  
  • Unlimited PTO, with management approval.  
  • Opportunities for professional development and continued learning.  
  • Optional 401K, FSA, and equity incentives available. 

Salary Range: $150,000-$200,000. This represents the typical salary range for this position based on experience, skills, and other factors. 

#LI-RCP

We’re an Equal Opportunity Employer: You’ll receive consideration for employment without regard to race, sex, color, religion, sexual orientation, gender identity, national origin, protected veteran status, or on the basis of disability.

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